Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects

Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects
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Total Pages : 498
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ISBN-10 : UOM:39015064810438
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Rating : 4/5 ( Downloads)

Book Synopsis Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects by : Ting Y. Tsui

Download or read book Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects written by Ting Y. Tsui and published by . This book was released on 2006 with total page 498 pages. Available in PDF, EPUB and Kindle. Book excerpt:


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