Integrated Interconnect Technologies for 3D Nanoelectronic Systems

Integrated Interconnect Technologies for 3D Nanoelectronic Systems
Author :
Publisher : Artech House
Total Pages : 551
Release :
ISBN-10 : 9781596932470
ISBN-13 : 1596932473
Rating : 4/5 (473 Downloads)

Book Synopsis Integrated Interconnect Technologies for 3D Nanoelectronic Systems by : Muhannad S. Bakir

Download or read book Integrated Interconnect Technologies for 3D Nanoelectronic Systems written by Muhannad S. Bakir and published by Artech House. This book was released on 2008-11-30 with total page 551 pages. Available in PDF, EPUB and Kindle. Book excerpt: This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.


Integrated Interconnect Technologies for 3D Nanoelectronic Systems Related Books

Integrated Interconnect Technologies for 3D Nanoelectronic Systems
Language: en
Pages: 551
Authors: Muhannad S. Bakir
Categories: Technology & Engineering
Type: BOOK - Published: 2008-11-30 - Publisher: Artech House

GET EBOOK

This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluid
3D Integration for VLSI Systems
Language: en
Pages: 376
Authors: Chuan Seng Tan
Categories: Science
Type: BOOK - Published: 2016-04-19 - Publisher: CRC Press

GET EBOOK

Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling
Physical Design for 3D Integrated Circuits
Language: en
Pages: 397
Authors: Aida Todri-Sanial
Categories: Technology & Engineering
Type: BOOK - Published: 2017-12-19 - Publisher: CRC Press

GET EBOOK

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3
Handbook of 3D Integration, Volume 4
Language: en
Pages: 492
Authors: Paul D. Franzon
Categories: Technology & Engineering
Type: BOOK - Published: 2019-01-25 - Publisher: John Wiley & Sons

GET EBOOK

This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate
Wireless Interface Technologies for 3D IC and Module Integration
Language: en
Pages: 337
Authors: Tadahiro Kuroda
Categories: Technology & Engineering
Type: BOOK - Published: 2021-09-30 - Publisher: Cambridge University Press

GET EBOOK

Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interf