Integrated Circuit Packaging, Assembly and Interconnections

Integrated Circuit Packaging, Assembly and Interconnections
Author :
Publisher : Springer Science & Business Media
Total Pages : 312
Release :
ISBN-10 : 9780387339139
ISBN-13 : 0387339132
Rating : 4/5 (132 Downloads)

Book Synopsis Integrated Circuit Packaging, Assembly and Interconnections by : William Greig

Download or read book Integrated Circuit Packaging, Assembly and Interconnections written by William Greig and published by Springer Science & Business Media. This book was released on 2007-04-24 with total page 312 pages. Available in PDF, EPUB and Kindle. Book excerpt: Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.


Integrated Circuit Packaging, Assembly and Interconnections Related Books

Integrated Circuit Packaging, Assembly and Interconnections
Language: en
Pages: 312
Authors: William Greig
Categories: Technology & Engineering
Type: BOOK - Published: 2007-04-24 - Publisher: Springer Science & Business Media

GET EBOOK

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the proces
Integrated Circuit Packaging, Assembly and Interconnections
Language: en
Pages: 0
Authors: William Greig
Categories: Technology & Engineering
Type: BOOK - Published: 2008-11-01 - Publisher: Springer

GET EBOOK

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the proces
Millimeter-Wave Integrated Circuits
Language: en
Pages: 259
Authors: Mladen Božanić
Categories: Technology & Engineering
Type: BOOK - Published: 2020-03-16 - Publisher: Springer Nature

GET EBOOK

This peer-reviewed book explores the methodologies that are used for effective research, design and innovation in the vast field of millimeter-wave circuits, an
Microelectronic Interconnections and Assembly
Language: en
Pages: 295
Authors: G.G. Harman
Categories: Technology & Engineering
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

GET EBOOK

MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel M
ICAE 2023
Language: en
Pages: 305
Authors: Nur Cahyono Kushardianto
Categories: Technology & Engineering
Type: BOOK - Published: 2024-01-19 - Publisher: European Alliance for Innovation

GET EBOOK

We are delighted to provide the proceedings of the sixth International Conference on Applied Engineering (ICAE), 2023, which was conducted in Batam on November