Heterogeneous Integrations

Heterogeneous Integrations
Author :
Publisher : Springer
Total Pages : 381
Release :
ISBN-10 : 9789811372247
ISBN-13 : 9811372241
Rating : 4/5 (241 Downloads)

Book Synopsis Heterogeneous Integrations by : John H. Lau

Download or read book Heterogeneous Integrations written by John H. Lau and published by Springer. This book was released on 2019-04-03 with total page 381 pages. Available in PDF, EPUB and Kindle. Book excerpt: Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.


Heterogeneous Integrations Related Books

Heterogeneous Integrations
Language: en
Pages: 381
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2019-04-03 - Publisher: Springer

GET EBOOK

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different funct
Chiplet Design and Heterogeneous Integration Packaging
Language: en
Pages: 542
Authors: John H. Lau
Categories: Technology & Engineering
Type: BOOK - Published: 2023-03-27 - Publisher: Springer Nature

GET EBOOK

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and e
TSV 3D RF Integration
Language: en
Pages: 294
Authors: Shenglin Ma
Categories: Technology & Engineering
Type: BOOK - Published: 2022-04-27 - Publisher: Elsevier

GET EBOOK

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-
Integration of Software Specification Techniques for Applications in Engineering
Language: en
Pages: 638
Authors: Hartmut Ehrig
Categories: Computers
Type: BOOK - Published: 2011-04-05 - Publisher: Springer

GET EBOOK

This book constitutes the documentation of the scientific outcome of the priority program Integration of Software Specification Techniques for Applications in E
Handbook of Research on Contemporary Perspectives on Web-Based Systems
Language: en
Pages: 582
Authors: Elçi, Atilla
Categories: Computers
Type: BOOK - Published: 2018-05-04 - Publisher: IGI Global

GET EBOOK

Information systems development underwent many changes as systems transitioned onto web-based forums. Complemented by advancements in security and technology, i