Continuum Damage Mechanics Based Failure Prediction Methodology for 95.5Sn-3.9Ag-0.6Cu Solder Alloy Interconnects in Electronic Packaging
| Author | : David Michael Pierce |
| Publisher | : |
| Total Pages | : 806 |
| Release | : 2007 |
| ISBN-10 | : OCLC:269367923 |
| ISBN-13 | : |
| Rating | : 4/5 ( Downloads) |
Book Synopsis Continuum Damage Mechanics Based Failure Prediction Methodology for 95.5Sn-3.9Ag-0.6Cu Solder Alloy Interconnects in Electronic Packaging by : David Michael Pierce
Download or read book Continuum Damage Mechanics Based Failure Prediction Methodology for 95.5Sn-3.9Ag-0.6Cu Solder Alloy Interconnects in Electronic Packaging written by David Michael Pierce and published by . This book was released on 2007 with total page 806 pages. Available in PDF, EPUB and Kindle. Book excerpt:
