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Advances In 3d Integrated Circuits And Systems
Language: en
Pages: 392
Authors: Hao Yu
Categories: Technology & Engineering
Type: BOOK - Published: 2015-08-28 - Publisher: World Scientific

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3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and S
Handbook of 3D Integration, Volume 1
Language: en
Pages: 798
Authors: Philip Garrou
Categories: Technology & Engineering
Type: BOOK - Published: 2011-09-22 - Publisher: John Wiley & Sons

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The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the r
3D Integration in VLSI Circuits
Language: en
Pages: 211
Authors: Katsuyuki Sakuma
Categories: Technology & Engineering
Type: BOOK - Published: 2018-04-17 - Publisher: CRC Press

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Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D int
3D Integration for VLSI Systems
Language: en
Pages: 376
Authors: Chuan Seng Tan
Categories: Science
Type: BOOK - Published: 2016-04-19 - Publisher: CRC Press

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Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling
Three-Dimensional Integrated Circuit Design
Language: en
Pages: 292
Authors: Yuan Xie
Categories: Technology & Engineering
Type: BOOK - Published: 2009-12-02 - Publisher: Springer Science & Business Media

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We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law