All operative mechanisms and processes that occur when a solder joint is formed are discussed. Areas addressed include solderability testing, the effects of flu

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as

In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on m

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end a

"Materials Science in Manufacturing focuses on materials science and materials processing primarily for engineering and technology students preparing for career