Modeling and Characterization of Electromigration Failures in IC Metallization Systems and Copper Metallization for ULSI Applications
| Author | : Jiang Tao |
| Publisher | : |
| Total Pages | : 358 |
| Release | : 1995 |
| ISBN-10 | : UCAL:C3389384 |
| ISBN-13 | : |
| Rating | : 4/5 ( Downloads) |
Book Synopsis Modeling and Characterization of Electromigration Failures in IC Metallization Systems and Copper Metallization for ULSI Applications by : Jiang Tao
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