Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysi

This book presents essentially a collection of proceedings that deliberate on the key challenges and recent trends on robotics, automation and data analytics wh

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes accor

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still ba