Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different funct

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and e

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-

This book constitutes the documentation of the scientific outcome of the priority program Integration of Software Specification Techniques for Applications in E

Electronic engineering and informatics are disciplines which underpin the complex digital technology on which we have all now come to depend. This book presents