Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D tec

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D tec

With topics ranging from epitaxy through lattice defects and doping to quantum computation, this book provides a personalized survey of the development and use

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the proces

This book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, ther