Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect mater

"Packaging materials, assembly processes, and the detailed understanding of multilayer mechanics have enabled much of the progress in miniaturization, reliabili

The chapters covered in this book include emerging new techniques on sintering. Major experts in this field contributed to this book and presented their researc

Die jüngsten Fortschritte im Bereich der drahtlosen Telekommunikation und dem Internet der Dinge sorgen bei drahtlosen Systemen, beim Satellitenfernsehen und b

Bridging the gap between textbook science and real-world engineering and operational applications, this reference presents comprehensive and easy-to-follow summ