Area Array Packaging Processes
Author | : Ken Gilleo |
Publisher | : McGraw-Hill Professional Publishing |
Total Pages | : 280 |
Release | : 2004 |
ISBN-10 | : UOM:39015057656863 |
ISBN-13 | : |
Rating | : 4/5 ( Downloads) |
Book Synopsis Area Array Packaging Processes by : Ken Gilleo
Download or read book Area Array Packaging Processes written by Ken Gilleo and published by McGraw-Hill Professional Publishing. This book was released on 2004 with total page 280 pages. Available in PDF, EPUB and Kindle. Book excerpt: This engineering reference covers the most important assembly processes in modern electronic packaging. It includes flip chip assembly and processes, die-attach, and BGA and CSP rework.