Related Books
Language: en
Pages: 44
Pages: 44
Type: BOOK - Published: 2021-07-19 - Publisher: John Wiley & Sons
3D and Circuit Integration of MEMS Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system
Language: en
Pages: 363
Pages: 363
Type: BOOK - Published: 2018-01-03 - Publisher: World Scientific
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical ac
Language: en
Pages: 582
Pages: 582
Type: BOOK - Published: 2019-01-25 - Publisher: John Wiley & Sons
This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and mate
Language: en
Pages: 392
Pages: 392
Type: BOOK - Published: 2015-08-28 - Publisher: World Scientific
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and S
Language: en
Pages: 406
Pages: 406
Type: BOOK - Published: 2003-07-25 - Publisher: John Wiley & Sons
Microelectromechanical systems (MEMS) refer to a collection of micro-sensors and actuators, which can react to environmental change under micro- circuit control