This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, M

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mech

Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect mater