Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium
Author :
Publisher : Springer Nature
Total Pages : 873
Release :
ISBN-10 : 9789811992674
ISBN-13 : 9811992673
Rating : 4/5 (673 Downloads)

Book Synopsis Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium by : Mohd Arif Anuar Mohd Salleh

Download or read book Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium written by Mohd Arif Anuar Mohd Salleh and published by Springer Nature. This book was released on 2023-07-02 with total page 873 pages. Available in PDF, EPUB and Kindle. Book excerpt: This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials. ​


Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium Related Books

Proceedings of the Green Materials and Electronic Packaging Interconnect Technology Symposium
Language: en
Pages: 873
Authors: Mohd Arif Anuar Mohd Salleh
Categories: Science
Type: BOOK - Published: 2023-07-02 - Publisher: Springer Nature

GET EBOOK

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, M
Fundamentals of Lead-Free Solder Interconnect Technology
Language: en
Pages: 266
Authors: Tae-Kyu Lee
Categories: Technology & Engineering
Type: BOOK - Published: 2014-11-05 - Publisher: Springer

GET EBOOK

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mech
Ceramic Interconnect Technology Handbook
Language: en
Pages: 456
Authors: Fred D. Barlow, III
Categories: Technology & Engineering
Type: BOOK - Published: 2018-10-03 - Publisher: CRC Press

GET EBOOK

Ceramics were among the first materials used as substrates for mass-produced electronics, and they remain an important class of packaging and interconnect mater
Microwave Materials and Applications
Language: en
Pages: 997
Authors: Mailadil T. Sebastian
Categories: Technology & Engineering
Type: BOOK - Published: 2017-03-02 - Publisher: John Wiley & Sons

GET EBOOK

Die jüngsten Fortschritte im Bereich der drahtlosen Telekommunikation und dem Internet der Dinge sorgen bei drahtlosen Systemen, beim Satellitenfernsehen und b
Lead-Free Solder Interconnect Reliability
Language: en
Pages: 292
Authors: Dongkai Shangguan
Categories: Technology & Engineering
Type: BOOK - Published: 2005 - Publisher: ASM International

GET EBOOK