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Microelectronics Packaging Handbook
Language: en
Pages: 1060
Authors: R.R. Tummala
Categories: Computers
Type: BOOK - Published: 2013-11-27 - Publisher: Springer Science & Business Media

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Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to pro
Microelectronics Packaging Handbook
Language: en
Pages: 742
Authors: R.R. Tummala
Categories: Technology & Engineering
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media

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Electronics has become the largest industry, surpassing agriCUlture, auto. and heavy metal industries. It has become the industry of choice for a country to pro
Microelectronics Packaging Handbook
Language: en
Pages: 662
Authors: Rao Tummala
Categories: Computers
Type: BOOK - Published: 1997-01-31 - Publisher: Springer Science & Business Media

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This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design method
RF and Microwave Microelectronics Packaging
Language: en
Pages: 295
Authors: Ken Kuang
Categories: Technology & Engineering
Type: BOOK - Published: 2009-12-01 - Publisher: Springer Science & Business Media

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RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers
Microelectronic Packaging
Language: en
Pages: 564
Authors: M. Datta
Categories: Technology & Engineering
Type: BOOK - Published: 2004-12-20 - Publisher: CRC Press

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Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnec