Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic in

This book provides an overview of the lastest developments in biobased materials and their applications in food packaging. Written by experts in their respectiv