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Language: en
Pages: 153
Pages: 153
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
Type: BOOK - Published: 2015-10-31 - Publisher: Springer
This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under
Language: en
Pages: 96
Pages: 96
Type: BOOK - Published: 2019-10-02 - Publisher: BoD – Books on Demand
This book provides some of the most advanced research observations and in-depth knowledge behind lead-free soldering. Readers will find a description of differe
Language: en
Pages: 780
Pages: 780
Type: BOOK - Published: 1989 - Publisher:
Language: en
Pages: 970
Pages: 970
Type: BOOK - Published: 1990 - Publisher:
Language: en
Pages: 1044
Pages: 1044
Type: BOOK - Published: 2004-02-27 - Publisher: CRC Press
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end a