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Language: en
Pages: 214
Pages: 214
Type: BOOK - Published: 2007-05-08 - Publisher: Springer Science & Business Media
This book addresses two main problems with interconnections at the chip and package level: crosstalk and simultaneous switching noise. Its orientation is toward
Language: en
Pages: 234
Pages: 234
Type: BOOK - Published: 2012-12-06 - Publisher: Springer Science & Business Media
This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI)
Language: en
Pages: 254
Pages: 254
Type: BOOK - Published: 2007-04-27 - Publisher: Springer Science & Business Media
This volume provides a complete understanding of the fundamental causes of routing congestion in present-day and next-generation VLSI circuits, offers technique
Language: en
Pages: 450
Pages: 450
Type: BOOK - Published: 2006-03-20 - Publisher: Springer Science & Business Media
In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, desig
Language: en
Pages: 122
Pages: 122
Type: BOOK - Published: 2014-11-07 - Publisher: Springer
The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniq