Electrical Design of Through Silicon Via

Electrical Design of Through Silicon Via
Author :
Publisher : Springer
Total Pages : 286
Release :
ISBN-10 : 9789401790383
ISBN-13 : 9401790388
Rating : 4/5 (388 Downloads)

Book Synopsis Electrical Design of Through Silicon Via by : Manho Lee

Download or read book Electrical Design of Through Silicon Via written by Manho Lee and published by Springer. This book was released on 2014-05-11 with total page 286 pages. Available in PDF, EPUB and Kindle. Book excerpt: Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.


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