Electronic Packaging Materials Science VII: Volume 323

Electronic Packaging Materials Science VII: Volume 323
Author :
Publisher :
Total Pages : 480
Release :
ISBN-10 : UCSD:31822016893182
ISBN-13 :
Rating : 4/5 ( Downloads)

Book Synopsis Electronic Packaging Materials Science VII: Volume 323 by : Peter Børgesen

Download or read book Electronic Packaging Materials Science VII: Volume 323 written by Peter Børgesen and published by . This book was released on 1994-03-21 with total page 480 pages. Available in PDF, EPUB and Kindle. Book excerpt: The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.


Electronic Packaging Materials Science VII: Volume 323 Related Books

Electronic Packaging Materials Science VII: Volume 323
Language: en
Pages: 480
Authors: Peter Børgesen
Categories: Technology & Engineering
Type: BOOK - Published: 1994-03-21 - Publisher:

GET EBOOK

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Electronic Packaging Materials Science
Language: en
Pages: 288
Authors:
Categories: Electronic packaging
Type: BOOK - Published: 1998 - Publisher:

GET EBOOK

Composite Materials
Language: en
Pages: 297
Authors: Deborah D.L. Chung
Categories: Technology & Engineering
Type: BOOK - Published: 2013-06-29 - Publisher: Springer Science & Business Media

GET EBOOK

Composite Materials is a modern reference book, tutorial in style, covering functions of composites relating to applications in electronic packaging, thermal ma
Proceedings of the Symposium on High Rate Metal Dissolution Processes
Language: en
Pages: 362
Authors: Madhav Datta
Categories: Technology & Engineering
Type: BOOK - Published: 1996 - Publisher: The Electrochemical Society

GET EBOOK

Interlayer Dielectrics for Semiconductor Technologies
Language: en
Pages: 459
Authors: Shyam P Muraka
Categories: Science
Type: BOOK - Published: 2003-10-13 - Publisher: Elsevier

GET EBOOK

Semiconductor technologies are moving at such a fast pace that new materials are needed in all types of application. Manipulating the materials and their proper