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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
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Type: BOOK - Published: 2021-01-28 - Publisher: CRC Press

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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the und
Mechanics of Solder Alloy Interconnects
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The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as
Fundamentals of Lead-Free Solder Interconnect Technology
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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mech
Design and Reliability of Solders and Solder Interconnections
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The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliabi
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
Language: en
Pages: 0
Authors: Ephraim Suhir
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Type: BOOK - Published: 2020 - Publisher:

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The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of