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Type: BOOK - Published: 2021-01-28 - Publisher: CRC Press
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices addresses analytical (mathematical) modeling approaches aimed at understanding the und
Language: en
Pages: 434
Pages: 434
Type: BOOK - Published: 1994-01-31 - Publisher: Springer Science & Business Media
The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as
Language: en
Pages: 266
Pages: 266
Type: BOOK - Published: 2014-11-05 - Publisher: Springer
This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mech
Language: en
Pages: 468
Pages: 468
Type: BOOK - Published: 1997 - Publisher: Minerals, Metals, & Materials Society
The reliability of solders and solder joints is an important factor in the durability and design of electronic packages. This volume addresses issues of reliabi
Language: en
Pages: 0
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Type: BOOK - Published: 2020 - Publisher:
The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of