As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consisten

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic in

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic diffe

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantl